Global 3D IC Market 2019-2023

This report provides an analysis of the market based on products (memory, LEDs, sensors, and MEMs) and geography (APAC, Europe, MEA, North America, and South America). The report also analyzes the market’s competitive landscape and offers information on several companies including ASE Group, SAMSUNG ELECTRONICS CO., LTD., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, and TOSHIBA CORPORATION.

Below are some of the key findings from this 3D IC market analysis report

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Global 3D IC market overview

There is a gradual shift in the preference of semiconductor device manufacturers from logic, analog, and discrete devices towards memory devices like 3D NAND and dynamic random access memory (DRAM). Benefits such as the significant reduction in data loss and the resistiveness towards the vibration of the device are boosting the adoption of semiconductor memory devices. With the expected launch of products integrated with 3D NAND by mobile device OEMs, several companies are making huge investments towards the production of 3D NAND. Moreover, there is also a growing preference for DRAM in applications such as mobile devices and high-performance computing as it consumes less power. This growing demand will induce companies to focus on increasing their production capacity to cater to the increasing demand for semiconductor memory devices. This will, in turn, drive 3D IC market growth at a CAGR of about 18% during 2019-2023.

There is also a growing interest in high-bandwidth memory (HBM) chips that have high-bandwidth and consume less power. With the increasing need for more-efficient memory chips, the preference for HBM chips over GDDR5 chips will increase in the coming years. Several vendors have started preferring HBMs, and one of the prominent companies has already announced the launch of 32GB or 64GB HBM DRAM. As HBM chips are high-density multi-die 3D ICs that can be attached to FPGAs, the increasing preference for HBM chips will subsequently drive 3D IC market growth.

Top 3D IC companies covered in this market research report

The 3D IC market is highly concentrated, and the market’s competitive environment is intense. By providing a complete analysis of the market’s competitive landscape and with information on the products offered by companies, this 3D IC industry analysis report will help clients to assess the market potential and design innovative strategies to strengthen their market positions.

The report offers a complete analysis of several vendors including:

• ASE Group
• SAMSUNG ELECTRONICS CO., LTD.
• STMicroelectronics N.V.
• Taiwan Semiconductor Manufacturing Company Limited
• TOSHIBA CORPORATION

3D IC market segmentation based on geographic regions

• APAC
• Europe
• MEA
• North America 
• South America

APAC will account for the largest 3D IC market share during the forecast period. The increasing demand for ICs from several end-user industries such as automotive and consumer electronics will be a major factor driving market growth in this region. This report provides an accurate prediction of the contribution of various segments to the growth of the 3D IC market size.

3D IC market segmentation based on product

• Memory
• LEDs 
• Sensors
• MEMS

The memory segment will account for the highest increase in the global 3D IC market during the forecast period. The increasing demand for fast, economical, and highly scalable memory module solutions is one of the critical factors that will drive 3D IC market growth in this segment.

Key highlights of the global 3D IC market report for the forecast period 2019-2023

• CAGR of the market during the forecast period 2019-2023
• Detailed information on factors that will accelerate the growth of the 3D IC market during the next five years
• Precise estimation of the global 3D IC market size and its contribution to the parent market
• Accurate predictions on upcoming trends and changes in consumer behavior
• The growth of the 3D IC industry across APAC, Europe, MEA, North America, and South America
• A thorough analysis of the market’s competitive landscape and detailed information on several vendors
• Comprehensive details on factors that will challenge the growth of the 3D IC companies