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The fan-out wafer level packaging market size is forecast to increase by USD 5.52 billion at a CAGR of 23.77% between 2023 and 2028. The fan-out wafer level packaging (FOWLP) market is experiencing significant growth due to the increasing demand for compactly designed electronics in various industries. One of the primary drivers is the increased adoption of semiconductor ICs in automobiles, sensors, communication modules, and wearables, among others. However, this trend comes with challenges, such as increased production costs due to warpage and the need for stringent quality control measures to ensure delivery timelines and device efficiency. The semiconductor supply chain is under pressure to keep up with the demands of the micro-electro-mechanical systems (MEMS), Internet of Things (IoT) devices, microcontrollers, power modules, and stacked die designs. The adoption of advanced silicon process technology and IC packaging technology is crucial to meet the demands of the market. The ultra-thin portable devices and compact design requirements necessitate the use of FOWLP for cost-effective and efficient manufacturing.
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Technology
7 Market Segmentation by Type
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
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