Global Flip Chip Packages Market 2018-2022

Below are some of the key findings from this flip chip packages market research report

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Global flip chip packages industry overview

With the rising demand for compact electronic devices from sectors including communication devices, healthcare equipment, and automotive industrial manufacturing, the semiconductor ICs companies have increased their R&D expenditure to reduce the size and improve the performance of ICs. This has led to the emergence of 3D IC chips and microelectromechanical systems (MEMS). The miniaturization of electronic devices will have a high impact on the global semiconductor packaging market. This, in turn, will boost the use of advanced packaging technologies such as flip-chip packaging to develop devices such as MEMS, 3D ICs, and FinFETs. The growing demand for compact electronic devices will be one of the key factors that will fuel flip chip packages market growth in the coming years.

The growing number of OSAT companies in APAC will be one of the key flip chip packaging market trends that will impact market growth during the forecast period. The governments of several countries in APAC including South Korea, Japan, and China are providing support to stimulate the growth of the semiconductor industry. For instance, the Made in China 2025 policy of the Government of China is focused on driving the growth of the semiconductor industry in all aspects, from chip design to manufacturing and packaging. With the increasing availability of finances, the number of OSAT companies will increase significantly in APAC, which will fuel the growth of the flip chip packaging market.

Top flip chip packages companies covered in this market research report

The flip chip packages market is fairly fragmented. By offering a complete analysis of the market’s competitive landscape and with information on the products offered by the companies, this flip chip packages industry analysis report will aid clients to identify new growth opportunities and design new growth strategies.

The report offers a complete analysis of various companies including:

• Advanced Semiconductor Engineering
• Chipbond Technology
• Intel
• Siliconware Precision Industries
• Taiwan Semiconductor Manufacturing Company

Flip chip packages market segmentation based on geographic regions

• Americas
• APAC
• EMEA

With a complete study of the growth opportunities for companies, APAC will account for the highest flip chip packages market share throughout the forecast period. The market dominance of APAC can be attributed to the industry shift toward the fabless model and the increasing volume of outsourcing to OSAT companies in the region.

Flip chip packages market segmentation based on end-users

• Communication sector
• Computing and networking sector
• Industrial sector
• Automotive sector
• Other end-users

There is a growing demand for communication devices such as tablet computers and smartwatches, especially in hospitality, Point of Sale, and ticketing and advertising applications. This will subsequently drive the need for flip chip packages from this industry. It has been estimated that the communication sector will account for the largest flip chip packages market share in the coming years. The report provides an accurate prediction of the contribution of the various products segments to the growth of the flip chip packages market size.

Key highlights of the global flip chip packages market for the forecast years 2018-2022:

• CAGR of the market during the forecast period 2018-2022
• Detailed information on factors that will accelerate the growth of the flip chip packages market during the next five years
• Precise estimation of the global flip chip packages market size and its contribution to the parent market
• Accurate predictions on upcoming trends and changes in consumer behavior
• The growth of the flip chip packages industry across the Americas, APAC, and EMEA
• A thorough analysis of the market’s competitive landscape and detailed information on several vendors
• Comprehensive details on the factors that will challenge the growth of flip chip packages companies