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Time-to-market remains an important benchmark that helps to improve business agility. Enterprises can gain significant benefits in terms of pricing and brand name by introducing products faster than competitors. Product-engineering solutions contribute to reducing development time and accelerate time-to-market. For instance, software product development firms find it difficult to reduce the time required to develop products with tighter budget constraints, limited workforce, and compliance issues. Vendors in this market are providing product engineering solutions to help independent software vendor (ISVs) and other clients to maintain product standards and service quality while accelerating time-to-market. Technavio’s market research analyst predicts the global product engineering services market to grow at a CAGR of around 10% during the forecast period.
The rising adoption of IoT solutions is anticipated to aid the market growth over the next four years. It is estimated that by 2020, there would be approximately 25 billion connected devices across the globe. Advanced sensor technologies can enhance M2M communications and provide better connectivity to improve IT systems. IoT solutions help end-users to enhance the customer experience and reduce costs through automated sensors, devices, and application services. For instance, leading vendors, such as TCS and Wipro, are providing end-to-end engineering services and solutions to implement IoT for various industry verticals such as automobiles, high-tech retail, aerospace, consumer packaged goods, energy, utilities, healthcare, and telecommunications.
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Market landscape
PART 06: Market segmentation by end-user
PART 07: Geographical segmentation
PART 08: Market drivers
PART 09: Impact of drivers
PART 10: Market challenges
PART 11: Impact of drivers and challenges
PART 12: Market trends
PART 13: Vendor landscape
PART 14: Key vendor analysis
PART 15: Appendix
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