Global Semiconductor Packaging Equipment Market 2016-2020

Table of Content

PART 01: Executive summary

• Highlights

PART 02: Scope of the report

• Definition
• Source year and forecast period
• Market reportage
• Market size computation
• Market segmentation
• Geographical coverage
• Vendor segmentation
• Common currency conversion rates
• Top-vendor offerings

PART 03: Market research methodology

• Research methodology
• Economic indicators

PART 04: Introduction

• Key market highlights

PART 05: Technology landscape

• Wafer-level versus die-level packaging and assembly
• Roadmap of semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape

• Customer perspective
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by type

• Types of packaging equipment
• Die-level packaging equipment
• Wafer-level packaging equipment

PART 08: Market segmentation by end-user

• Global semiconductor packaging equipment market by end-user
• OSATs
• IDMs

PART 09: Geographical segmentation

• Global semiconductor packaging equipment market by region
• APAC
• North America
• Europe

PART 10: Market drivers

• Growing number of fabs
• High demand for polymer adhesive wafer bonding equipment
• Complex semiconductor IC designs
• Explosive growth of wireless computing devices along with advent of IoT
• Growing demand for compact electronic devices
• High need for SoC technology

PART 11: Impact of drivers

PART 12: Market challenges

• High inventory levels in supply chain
• Dependency on few key suppliers
• Fluctuation of foreign exchange rates
• High investment market

PART 13: Impact of drivers and challenges

PART 14: Market trends

• Development of 3D chip packaging
• Increase in number of OSAT vendors
• Growing number of mergers and acquisitions
• FOWLP technology
• High need for semiconductor memory devices
• Growing acceptance of wearable devices
• Automation in automobiles

PART 15: Vendor landscape

• Competitive scenario
• Key vendors
• Other prominent vendors

PART 16: Appendix

• List of abbreviations

PART 17: Explore Technavio