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The semiconductor wafer polishing and grinding equipment market size is projected to increase by USD 442.01 million at a CAGR of 4.06% between 2023 and 2028. The growth rate of the market depends on several factors, including the emergence of miniaturized semiconductor components, the growing investment in new fabrication plants, and the incentives and discounts for long-term customers of end-users.
The market growth and forecasting report includes key player's detailed analyses of the competitive landscape of the market and information about 15 market companies, including ALLIED HIGH TECH PRODUCTS, INC, Amtech Systems Inc., ASM International NV, DISCO Corp., G and N GmbH, Gigamat Technologies Inc, KLA Corp., Lapmaster Wolters, Logitech Ltd., Okamoto Corp, Revasum Inc., S Cubed, S3 Alliance., Tokyo Electron Ltd., TOKYO SEIMITSU CO. LTD, ULTRA TEC Manufacturing Inc., UNITED GRINDING North America, Inc., and Ebara Corp. Additionally, Applied Materials Inc. company offers products such as Mirra CMP 200mm, Opta CMP, and Reflexion LK Prime CM, which removes and planarizes excess material on the wafers front surface by applying precise downforce.
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The emergence of miniaturized components is the key factor driving the market. Market players are focusing on manufacturing miniaturized personal electronics that consume less power. Semiconductor components range from IC and chips to LED displays. There has been a surge in demand for miniaturized electronic devices. This means the manufacturers need to focus on reducing the size of the device without compromising its performance. The IC chips installed in the system need to be small and deliver better performance while keeping the power consumption low. In addition, advancements in semiconductor wafer inspection equipment play a critical role in this trend. These tools ensure the quality and reliability of miniaturized semiconductor components by meticulously inspecting semiconductor wafers at microscopic levels. This process is essential to maintain high standards of performance and reliability in IC chips and other semiconductor devices.
Additionally, with the miniaturization of electronic devices, the use of optimized and miniaturized electronic circuits made of material developed on miniaturized substrates has increased. This helps in keeping the structure of the entire device small while delivering the same. With the evolution of consumer electronics, the demand for miniaturized ICs will grow. Hence, the demand is also expected to grow, thereby propelling the development of the market during the forecast period.
The transition toward 3D structures is one of the primary market trends. The 3D chip architecture allows several layers to be stacked on top of each other, making the IC more compact. 3D ICs can be used for smart device applications, photonics, imaging, and advanced logic. 3D NAND is expected to grow during the forecast period due to the increasing demand for 3D NAND flash for applications such as data center storage, smartphones, and memory cards.
Furthermore, to meet the industry demand for increased levels of integration and enhanced form factors, latency, performance, and weight, microelectronic device manufacturers are implementing 3D chip stacking. Since these chips are designed in a different manner, the packaging of these chips, along with their interconnects, is a necessity. The use of TSV chips is a lucrative opportunity for wafer polishing and grinding equipment manufacturers, as the creation of TSV chips leaves excess material on the wafer surface. Abrasives are essential in the process of wafer polishing and grinding, playing a critical role in removing excess material and achieving the precise surface flatness required for optimal chip performance. Semiconductor wafer inspection equipment also ensures the quality and reliability of these advanced chips by meticulously examining their structural integrity, defect levels, and electrical characteristics. Thus, such factors are expected to propel the expansion of the market during the forecast period.
An increased gap between development times is a major challenge that affects market expansion. As the demand for semiconductor ICs rises, the requirements for such tools also increase. The nature of the cyclicity of this industry makes it difficult to forecast the demand for ICs. Consequently, the orders will be placed by semiconductor foundries once there is a foreseeable increase in the number of ICs. Manufacturing activities of market players include the assembly, testing, and integration of various proprietary components, parts, and sub-assemblies. The procurement of these components is through global market players.
Furthermore, any delay from market players will result in a delay in the manufacturing of such equipment. There is a high dependence on the suppliers of equipment components by semiconductor foundries. This is a major challenge because the development time of these tools increases drastically, which causes delays in the release of the equipment to foundries. Thus, such factors may limit the expansion of the market during the forecast period.
The market share by the 300 Mm segment will be significant during the forecast period. 300 mm segment by application of the market is expected to grow due to large-scale usage in memory ICs. Major memory manufacturers such as SAMSUNG, Micron Technology, and SK HYNIX have been developing memory ICs built on 300 mm wafers, and they are some of the major users of 300 mm wafers. Foundries such as Taiwan Semiconductor Manufacturing Company, GLOBALFOUNDRIES, United Microelectronics, and SMIC are also developing ICs that are best suited to be developed on a 300 mm wafer.
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The 300 Mm segment showed a gradual increase in the market share of USD 1.13 billion in 2018. Furthermore, an increase in the number of fabs will result in a rise in the demand during the forecast period. Since the transition toward a 450 mm wafer size has not been achieved yet, most of the production of ICs will continue to be done on 300 mm wafers. Various firms, such as SAMSUNG, have increased their spending on developing new 300 mm wafer fabs. Once these fabs become operational, the need for such equipment is expected to arise, which is anticipated to propel the growth of the market in the 300 mm segment during the forecast period.
The foundries?segment will account for the largest share of this segment.? The market will continue to grow at a moderate rate, with demand stemming from the developing regions of APAC, such as India, Bangladesh, Thailand, and Nepal. The high growth potential of these countries in terms of demand for electronic devices will drive original equipment manufacturers (OEMs) of electronic devices to order more devices for their end-products. Consequently, the market will witness considerable demand for devices such as memory, logic, discrete, analog, sensor, and opto devices during the forecast period. Further, the demand for such tools will increase once the construction of the fabs is completed. Therefore, there could be an increase in the demand for such equipment, which is expected to trigger the growth of the market during the forecast period.
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Application
7 Market Segmentation by End-user
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
13 Appendix
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