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The semiconductor wafer polishing and grinding equipment market size is projected to increase by USD 442.01 million at a CAGR of 4.06% between 2023 and 2028. The growth rate of the market depends on several factors, including the emergence of miniaturized semiconductor components, the growing investment in new fabrication plants, and the incentives and discounts for long-term customers of end-users.
The market growth and forecasting report includes key player's detailed analyses of the competitive landscape of the market and information about 15 market companies, including ALLIED HIGH TECH PRODUCTS, INC, Amtech Systems Inc., ASM International NV, DISCO Corp., G and N GmbH, Gigamat Technologies Inc, KLA Corp., Lapmaster Wolters, Logitech Ltd., Okamoto Corp, Revasum Inc., S Cubed, S3 Alliance., Tokyo Electron Ltd., TOKYO SEIMITSU CO. LTD, ULTRA TEC Manufacturing Inc., UNITED GRINDING North America, Inc., and Ebara Corp. Additionally, Applied Materials Inc. company offers products such as Mirra CMP 200mm, Opta CMP, and Reflexion LK Prime CM, which removes and planarizes excess material on the wafers front surface by applying precise downforce.
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The emergence of miniaturized components is the key factor driving the market. Market players are focusing on manufacturing miniaturized personal electronics that consume less power. Semiconductor components range from IC and chips to LED displays. There has been a surge in demand for miniaturized electronic devices. This means the manufacturers need to focus on reducing the size of the device without compromising its performance. The IC chips installed in the system need to be small and deliver better performance while keeping the power consumption low. In addition, advancements in semiconductor wafer inspection equipment play a critical role in this trend. These tools ensure the quality and reliability of miniaturized semiconductor components by meticulously inspecting semiconductor wafers at microscopic levels. This process is essential to maintain high standards of performance and reliability in IC chips and other semiconductor devices.
Additionally, with the miniaturization of electronic devices, the use of optimized and miniaturized electronic circuits made of material developed on miniaturized substrates has increased. This helps in keeping the structure of the entire device small while delivering the same. With the evolution of consumer electronics, the demand for miniaturized ICs will grow. Hence, the demand is also expected to grow, thereby propelling the development of the market during the forecast period.
The transition toward 3D structures is one of the primary market trends. The 3D chip architecture allows several layers to be stacked on top of each other, making the IC more compact. 3D ICs can be used for smart device applications, photonics, imaging, and advanced logic. 3D NAND is expected to grow during the forecast period due to the increasing demand for 3D NAND flash for applications such as data center storage, smartphones, and memory cards.
Furthermore, to meet the industry demand for increased levels of integration and enhanced form factors, latency, performance, and weight, microelectronic device manufacturers are implementing 3D chip stacking. Since these chips are designed in a different manner, the packaging of these chips, along with their interconnects, is a necessity. The use of TSV chips is a lucrative opportunity for wafer polishing and grinding equipment manufacturers, as the creation of TSV chips leaves excess material on the wafer surface. Abrasives are essential in the process of wafer polishing and grinding, playing a critical role in removing excess material and achieving the precise surface flatness required for optimal chip performance. Semiconductor wafer inspection equipment also ensures the quality and reliability of these advanced chips by meticulously examining their structural integrity, defect levels, and electrical characteristics. Thus, such factors are expected to propel the expansion of the market during the forecast period.
An increased gap between development times is a major challenge that affects market expansion. As the demand for semiconductor ICs rises, the requirements for such tools also increase. The nature of the cyclicity of this industry makes it difficult to forecast the demand for ICs. Consequently, the orders will be placed by semiconductor foundries once there is a foreseeable increase in the number of ICs. Manufacturing activities of market players include the assembly, testing, and integration of various proprietary components, parts, and sub-assemblies. The procurement of these components is through global market players.
Furthermore, any delay from market players will result in a delay in the manufacturing of such equipment. There is a high dependence on the suppliers of equipment components by semiconductor foundries. This is a major challenge because the development time of these tools increases drastically, which causes delays in the release of the equipment to foundries. Thus, such factors may limit the expansion of the market during the forecast period.
The market share by the 300 Mm segment will be significant during the forecast period. 300 mm segment by application of the market is expected to grow due to large-scale usage in memory ICs. Major memory manufacturers such as SAMSUNG, Micron Technology, and SK HYNIX have been developing memory ICs built on 300 mm wafers, and they are some of the major users of 300 mm wafers. Foundries such as Taiwan Semiconductor Manufacturing Company, GLOBALFOUNDRIES, United Microelectronics, and SMIC are also developing ICs that are best suited to be developed on a 300 mm wafer.
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The 300 Mm segment showed a gradual increase in the market share of USD 1.13 billion in 2018. Furthermore, an increase in the number of fabs will result in a rise in the demand during the forecast period. Since the transition toward a 450 mm wafer size has not been achieved yet, most of the production of ICs will continue to be done on 300 mm wafers. Various firms, such as SAMSUNG, have increased their spending on developing new 300 mm wafer fabs. Once these fabs become operational, the need for such equipment is expected to arise, which is anticipated to propel the growth of the market in the 300 mm segment during the forecast period.
The foundries?segment will account for the largest share of this segment.? The market will continue to grow at a moderate rate, with demand stemming from the developing regions of APAC, such as India, Bangladesh, Thailand, and Nepal. The high growth potential of these countries in terms of demand for electronic devices will drive original equipment manufacturers (OEMs) of electronic devices to order more devices for their end-products. Consequently, the market will witness considerable demand for devices such as memory, logic, discrete, analog, sensor, and opto devices during the forecast period. Further, the demand for such tools will increase once the construction of the fabs is completed. Therefore, there could be an increase in the demand for such equipment, which is expected to trigger the growth of the market during the forecast period.
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APAC is estimated to contribute 68% to the growth of the global market during the forecast period.
Technavio's analysts have provided extensive insight into the market forecast, detailing the regional trends and drivers influencing the market's trajectory throughout the forecast period. In APAC, the presence of numerous prominent foundries such as TSMC, Samsung, and SMIC is creating the demand for such equipment. The region has a few key countries, such as Taiwan, South Korea, Japan, and China, that contribute heavily to the demand as they house most of the major manufacturers. In addition, the presence of dominant players, such as Samsung, Sony, LG, Toshiba, and Panasonic, in the consumer electronics and mobile devices market is supporting the demand in APAC.
Additionally, the demand for miniaturized ICs is increasing from several end-user industries such as consumer, healthcare, optical, and others, primarily due to advances in wired and wireless technologies, growing implementation of IoT, increasing automation in industries, and growing investment in human-machine interface (HMI) technologies. Furthermore, the rising number of investments in the construction of new fabrication plants is expected to lead to an increase in demand during the forecast period. Thus, such factors are expected to increase the demand in APAC, which, in turn, is anticipated to propel the expansion of the regional market during the forecast period.
The market forecasting report includes the adoption lifecycle of the market research and growth, covering from the innovator’s stage to the laggard’s stage. It focuses on adoption rates in different regions based on penetration. Furthermore, the report also includes key purchase criteria and drivers of price sensitivity to help companies evaluate and develop their market growth and trends strategies.
Global Market Customer Landscape
Companies are implementing various strategies, such as strategic alliances, partnerships, mergers and acquisitions, geographical expansion, and product/service launches, to enhance their presence in the market.
Market analysis and report of qualitative and quantitative analysis of companies has been conducted to help clients understand the wider business environment as well as the strengths and weaknesses of key market players. Data is qualitatively analyzed to categorize companies as pure play, category-focused, industry-focused, and diversified; it is quantitatively analyzed to categorize companies as dominant, leading, strong, tentative, and weak.
The market research report forecasts market growth by revenue at global, regional & country levels and provides an analysis of the latest trends and growth opportunities from 2018-2028
The market is integral to IC manufacturing and MEMS production, catering to diverse sectors like optics and compound semiconductors. With a focus on silicon ICs and wafer-dependent packages, the market is driven by silicon wafer shipments measured in square inches. Advanced polishing techniques and CMP (Chemical-Mechanical Polishing) technology enhance wafer fabrication processes, supported by service providers offering wafer reclaim activities.
Furthermore, as digitalization propels the demand for tablets, smart home devices, and wearables, the market thrives on integrated circuits powering automotive applications, artificial intelligence, and Internet of Things (IoT) devices. The production of SoC dice and packaging and testing services play pivotal roles in meeting the needs of microelectronic devices and wearable healthcare products. With a focus on chemical-mechanical polishing, semiconductor glass wafers, silicon wafers, and electronic innovations, the market continues to evolve in tandem with advancements in semiconductor materials and MOS technology. Semiconductor glass wafers, known for their high thermal conductivity and optical transparency, are crucial in applications requiring precision, such as optical sensors and displays, complementing the innovation trajectory of the semiconductor industry.
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Semiconductor Wafer Polishing and Grinding Equipment Market Scope |
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Report Coverage |
Details |
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Page number |
172 |
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Base year |
2023 |
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Historic period |
2018-2022 |
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Forecast period |
2024-2028 |
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Growth momentum & CAGR |
Accelerate at a CAGR of 4.06% |
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Market Growth 2024-2028 |
USD 442.01 million |
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Market structure |
Fragmented |
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YoY growth 2023-2024(%) |
3.94 |
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Regional analysis |
APAC, North America, Europe, South America, and Middle East and Africa |
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Performing market contribution |
APAC at 68% |
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Key countries |
US, South Korea, Taiwan, China, and Japan |
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Competitive landscape |
Leading Companies, Market Positioning of Companies, Competitive Strategies, and Industry Risks |
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Key companies profiled |
ALLIED HIGH TECH PRODUCTS, INC, Amtech Systems Inc., Applied Materials Inc., ASM International NV, Axus Technology, DISCO Corp., G and N GmbH, Gigamat Technologies Inc, KLA Corp., Lapmaster Wolters, Logitech Ltd., Okamoto Corp, Revasum Inc., S Cubed, S3 Alliance., Tokyo Electron Ltd., TOKYO SEIMITSU CO. LTD, ULTRA TEC Manufacturing Inc., UNITED GRINDING North America, Inc., and Ebara Corp. |
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Market dynamics |
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for the forecast period. |
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Customization purview |
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1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Application
7 Market Segmentation by End-user
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
13 Appendix
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