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The global copper clad laminate market size is estimated to grow by USD 4.29 billion between 2023 and 2028 exhibiting a CAGR of 4.63%. The growth rate of the market depends on several factors such as the rising adoption of smartphones, the increasing usage of electronic components in vehicles, and the growing focus on 5G services.
The report includes a comprehensive outlook on the Market, offering forecasts for the industry segmented by Type, which comprises rigid and flexible. Additionally, it categorizes Material into epoxy resin-based, phenolic resin-based, polyimide resin-based, and others and covers Regions, including APAC, North America, Europe, Middle East and Africa, and South America. The report provides market size, historical data spanning from 2018 to 2022, and future projections, all presented in terms of value in USD billion for each of the mentioned segments.
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Our researchers analyzed the data with 2023 as the base year, along with the key drivers, trends, and challenges. A holistic analysis of drivers will help companies refine their marketing strategies to gain a competitive advantage.
Increasing usage of electronic components in vehicles is the key factor driving market growth. The demand for copper clad laminate from the automotive industry is anticipated to grow owing to increasing electronic components in vehicles, like the introduction of advanced driver-assistance systems (ADAS) and infotainment systems in mass mid-segment vehicles. The increasing deployment of automation systems in vehicles is leading to the higher integration of advanced electronic components such as actuators, microcontrollers, and sensors to enable in-vehicle communication.
Moreover, automotive original equipment manufacturers (OEMs) are incorporating smart features in their vehicles, such as automatic transmissions, central locking, gesture recognition, voice recognition, and others. The growth of in-vehicle electronics in automotive will accelerate the demand for copper clad laminate, supporting many electronic components integrated into it. This will propel the growth of the market during the forecast period.
The advent of high-density interconnect technology is the primary trend shaping market growth. The electronic industry is witnessing an increasing need for efficient data transfer along with low power consumption. Consequently, the trend for miniaturization of electronic components is attaining traction in the market, resulting in high circuit density, which leads to a complex interconnection between the components. High-density interconnect (HDI) substrates are made up of high-density circuits, which make it easy for the electronic components to be mounted on the PCB and send and receive signals among themselves.
Moreover, HDI is a crucial technology as it lowers manufacturing costs, eases the PCB design flow, and makes it compatible with new-generation electronic devices. In addition, an increase in the demand for PCB induced by HDI technology will increase the demand for copper-clad laminate since copper-clad laminate is the fundamental building block material used in the fabrication of printed circuit boards. Thus, the advent of HDI technology will drive the growth of the market during the forecast period.
Manufacturing defects of copper-clad laminate is a challenge that affects market growth. Numerous unexpected factors may emerge within the copper foil manufacturing process, leading to several problems. Damage, dents, resin points, wrinkles, bubbles, and other defects could be among these issues. These kinds of problems reduce the copper-clad laminate's performance and negatively impact the printed board's quality when they occur. Ensuring sure the copper-clad laminate satisfies critical requirements, such as water absorption and anti-corrosion qualities, is important.
Furthermore, the final design specifies the exact dimensions that the copper-clad laminate, which is the PCB's foundation material, must meet. Different parameters, such as width, length, diagonal deviation, and warpage, are carefully evaluated. Not meeting these size conditions specifically can lead to the unsuccessful application of copper clad laminate. Hence, manufacturing defects of copper clad laminate may impede market growth during the forecast period.
The rigid segment is estimated to witness significant growth during the forecast period. Rigid copper clad laminate, typically referred to as PCB laminate, is a type of substrate material used in PCBs that has a thin layer of copper lamination on either one or both of the sides of PCB (double copper clad laminate or single copper clad laminate). Manufacturers create multi, double, and single-layer rigid PCBs utilizing substrate materials such as FR-4 (epoxy resin), polytetrafluoroethylene (PTFE), ceramic, and metal core (copper or aluminum).
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The rigid segment was the largest segment and was valued at USD 10.77 billion in 2018. The material known as Flame Retardant-4 (FR-4) is made of a self-extinguishing (flame-resistant) epoxy resin laminate and woven glass fiber fabric. Rigid copper clad laminates are difficult to bend and have a certain hardness and toughness. With the rapid development of the electronics manufacturing industry, the demand for rigid copper clad laminates continues to increase. Hence, these factors will drive the growth of the rigid copper clad laminates segment and the market during the forecast period.
The structure and performance of epoxy resin, a primary raw material for copper-clad laminate used as a printed circuit board substrate, are vital factors that affect the performance of the finished product. Also, the performance of copper clad laminate is progressively enhancing due to the ongoing advancements in epoxy resin. Furthermore, copper clad laminate mechanical properties of copper clad laminate enable it to function as a supporting component in electronic goods. Thus, such factors will drive the growth of the segment and market during the forecast period.
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Type
7 Market Segmentation by Material
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
13 Appendix
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