Global System-in-Package Market 2016-2020

Table of Content

PART 01: Executive summary

• Highlights

PART 02: Scope of  the report

• Definition
• Source year and forecast period
• Market overview
• Segmentation
• Geographical coverage
• Vendor segmentation
• Common currency conversion rates
• Top-vendor offerings

PART 03: Market research methodology

• Research methodology
• Economic indicators

PART 04: Introduction

• Key market highlights

PART 05: Technology overview

• Back-end chip formation
• Wafer-level versus die-level packaging and assembly
• Evolution of semiconductor packaging industry
• Eco-system of semiconductor IC packaging industry

PART 06: Market landscape

• Market overview
• Comparison between SoC, SiP, and chip-on-board (CoB)
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation  by application

• Communications sector
• Consumer electronics sector
• Computers sector
• Automotive sector
• Medical sector

PART 08: Market segmentation by interconnect technology

• Wire bond packaging
• Flip-chip packaging

PART 09: Market segmentation by end-user

• Foundries
• IDMs

PART 10: Geographical segmentation

• APAC
• Americas
• EMEA

PART 11: Market drivers

• Need to control rising costs
• Emergence of advanced and compact consumer electronic devices
• Rise in number of fabs
• Increasing number of IoT devices
• Design complexities in SoC

PART 12: Impact of drivers

PART 13: Market challenges

• High inventory levels in supply chain
• Fluctuation of foreign exchange rates
• High investment market

PART 14: Impact of drivers and challenges

PART 15: Market trends

• Growth of OSAT vendors
• Emergence of FOWLP technology
• Automation in automobiles

PART 16: Vendor landscape

• Competitive scenario
• Key vendors
• Other prominent vendors

PART 17: Appendix

• List of abbreviations

PART 18: Explore Technavio