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The compound semiconductor market size is forecast to increase by USD 17.56 billion at a CAGR of 7.03% between 2023 and 2028. The market's growth rate hinges on various factors, notably the escalating demand for enhanced power density, driven by technological advancements and the proliferation of portable devices. Additionally, the rising adoption of smartphones fuels market expansion, reflecting increased consumer reliance on mobile technology. Moreover, the growing need for enhanced communication networks, driven by evolving connectivity requirements, contributes significantly to market growth, shaping the trajectory of the industry.
The market growth and forecasting report includes key player's detailed analyses of the competitive landscape of the market and information about 20 market companies, including Broadcom Inc., Infineon Technologies AG, IQE Plc, Microchip Technology Inc., Micron Technology Inc., Mitsubishi Electric Corp., Nichia Corp., NXP Semiconductors NV, Qorvo Inc., Qualcomm Inc., Renesas Electronics Corp., Samsung Electronics Co. Ltd., Skyworks Solutions Inc., Sony Group Corp., STMicroelectronics International NV, Texas Instruments Inc., Toshiba Corp., and Wolfspeed Inc. Additionally, Advanced Wireless Semiconductor Co. s key company, offers compound semiconductor such as InGaP HBT, Switch pHEMT, Cu Pillar Bump, 0.5um ED pHEMT, 0.25um ED pHEMT, 0.15um E pHEMT, 0.25um ED BiHEMT, and VCSEL.
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Type
7 Market Segmentation by End-user
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
13 Appendix
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