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Market research analysts at Technavio have predicted that the global kiln shell scanner market will grow steadily and post a CAGR of about 3% by 2020. This market research analysis identifies the increased use of wireless technology for rotary kiln shell scanners as one of the primary growth factors for this market. Conventional data collection methods involve manual inspections with handheld thermometers and pyrometers and are highly inefficient and potentially dangerous. As a result, end-users have started preferring the use of wireless devices that can be placed in close proximity and collect accurate real-time data. Online permanent systems provide continuous coverage and data of rotary kilns for production processes. Additionally, wireless technologies also offer advantages such as convenience of operations, increased speed of industrial data transmissions, untethered operations, easy access to hazardous areas, and an overall reduction in operational costs.
One of the newest additions to rotary kiln shell scanner technology is the cloud-enabled software, which enables an interactive platform for end-users with multiple options and constant real-time input. Consolidated into meaningful information, this can help detect defects in shell lining and facilitates better decision making. It also allows rapid data sharing across different locations which help end-users to collaborate easily with kiln manufacturers and effectively schedule repairs. Their ease of operation and numerous benefits have induced several manufacturers to offer cloud-based solutions with their kiln shell systems.
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Market research methodology
PART 04: Introduction
PART 05: Market landscape
PART 06: Market segmentation by end-user
PART 07: Geographical segmentation
PART 08: Market drivers
PART 09: Impact of drivers
PART 10: Market challenges
PART 11: Impact of drivers and challenges
PART 12: Market trends
PART 13: Vendor landscape
PART 14: Key takeaways
PART 15: Appendix
PART 16: Explore Technavio
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