Global 3D Semiconductor Packaging Market 2016-2020

Overview of the global 3D semiconductor packaging market

Technavio’s market research analyst predicts that the global 3D semiconductor packaging market will grow at a significant CAGR of just over 16% during the forecast period. One of the key drivers of this market is the need to control chip design costs. With the advent of technologies like the Internet of Things, it is becoming difficult to develop electronic devices that can accommodate evolving technologies. High design costs restrict manufacturers from using aggressive pricing strategies. 3D semiconductor packing is helping vendors come up with practical manufacturing designs which then help to keep prices in check and propel market growth during the forecast period.

A significant trend spurring the market growth of 3D semiconductor packaging is the increasing demand for miniaturized electronics.  Samsung and Apple are manufacturing compact devices which consume less power as demand for low-cost, high-performance devices is on the rise. 3D packaging plays a crucial role in miniaturized electronics as it allows manufacturers to use through silicon via (TSV) and 3D stacking to reduce the size of products and also improve performance with better functionality.

Segmentation by application and analysis of the 3D semiconductor packaging market

• Consumer electronics
• Others